Through-Silicon Vias for 3D Integration by John Lau - Hardback

Through-Silicon Vias for 3D Integration by John Lau - Hardback

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SKU:
9780071785143
UPC:
9780071785143

Product Description

ISBN: 9780071785143
TITLE: Through-Silicon Vias for 3D Integration
AUTHOR: John Lau
PUBLISHER: McGraw-Hill Education - Europe
PUBLISHER DATE: 16 Dec 2012

Other Details

ISBN:
9780071785143
Author:
John Lau
Publisher:
McGraw-Hill Education - Europe
Publisher Date:
16 Dec 2012
Book Format:
Hardback

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