3D IC Integration and Packaging by John Lau - Hardback

3D IC Integration and Packaging by John Lau - Hardback

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SKU:
9780071848060
UPC:
9780071848060

Product Description

ISBN: 9780071848060
TITLE: 3D IC Integration and Packaging
AUTHOR: John Lau
PUBLISHER: McGraw-Hill Education - Europe
PUBLISHER DATE: 16 Oct 2015

Other Details

ISBN:
9780071848060
Author:
John Lau
Publisher:
McGraw-Hill Education - Europe
Publisher Date:
16 Oct 2015
Book Format:
Hardback

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