Microelectronics Packaging Handbook : Subsystem Packaging Part III by R.R. Tummala - Hardback

Microelectronics Packaging Handbook : Subsystem Packaging Part III by R.R. Tummala - Hardback

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SKU:
9780412084515
UPC:
9780412084515

Product Description

ISBN: 9780412084515
TITLE: Microelectronics Packaging Handbook : Subsystem Packaging Part III
AUTHOR: R.R. Tummala
PUBLISHER: Chapman and Hall
PUBLISHER DATE: 31 Jan 1997

Other Details

ISBN:
9780412084515
Author:
R.R. Tummala
Publisher:
Chapman and Hall
Publisher Date:
Published:31 Jan 1997
Book Format:
Hardback

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