Development of 3D VLSI Integration Technology Using Copper-Plated Through Silicon Vias by Yang Liu - Paperback

Development of 3D VLSI Integration Technology Using Copper-Plated Through Silicon Vias by Yang Liu - Paperback

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SKU:
9781243715814
UPC:
9781243715814

Product Description

ISBN: 9781243715814
TITLE: Development of 3D VLSI Integration Technology Using Copper-Plated Through Silicon Vias
AUTHOR: Yang Liu
PUBLISHER: Proquest, Umi Dissertation Publishing
PUBLISHER DATE: 1 Sep 2011

Other Details

ISBN:
9781243715814
Author:
Yang Liu
Publisher:
Proquest, Umi Dissertation Publishing
Publisher Date:
Published:1 Sep 2011
Book Format:
Paperback

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